Semi Automatic Wedge Wire Bonder
The inseto iBond5000 Wedge bonder is the latest model from MPP. It can wedge-wedge bond for wire and ribbon bonding in aluminium, gold and copper.
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The bonder:
- Programmable looping profiles including lange-coupler mode
- 30/45 and 90 (deep access) degree wire feed configurations
- Consistent tail length control with fine adjust
- Simple to use semiautomatic and manual operation modes
- Comprehensive range of work holders and customised fixtures
- User friendly touch screen graphical user interface
- Large bondable area: 135 mm x 135 mm (5.3鈥 x 5.3鈥)
