@inproceedings{inproceedings, title  = {{Thermal stability of self-assembled monolayer copper preservatives for fluxless soldering}},

 url = {{}},

 year = {{2006}},

 month = {{1}},

 author = {{Ebbens SJ and Hutt DA and Liu CQ}},

 journal = {{ESTC 2006: 1st Electronics Systemintegration Technology Conference, Vols 1 and 2, Proceedings}},

 pages = {{1360-1366}},

 note = {{Accessed on 2024/12/22}}}