@inproceedings{inproceedings, title  = {{Modelling the enhancement to the thermal performance of encapsulants using thermally conductive filler materials}},

 publisher = {{Stuttgart, Germany; Mesago PCIM GmbH; [2014]}},

 url = {{}},

 year = {{2015}},

 month = {{6}},

 author = {{Hewitt D and Stone DA and Foster MP}},

 journal = {{PCIM Asia Conference Proceedings}},

 note = {{Accessed on 2024/10/23}}}