TY  - CONF

T1  - A new back-to-back graded AlGaN barrier for complementary integration technique based on GaN/AlGaN/GaN platform

JO  - 2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)

UR  - http://dx.doi.org/10.1109/edtm55494.2023.10103055

PY  - 2023/03/07

AU  - Zhou J

AU  - Do H-B

AU  - De Souza MM

ED  - 

DO  - DOI: 10.1109/edtm55494.2023.10103055

PB  - IEEE

Y2  - 2024/12/20

ER  -