TY  - JOUR

T1  - Non-destructive mapping of stress and strain in soft thin films through sound waves

JO  - Communications Physics

UR  - http://dx.doi.org/10.1038/s42005-022-01000-3

PY  - 2022/09/17

AU  - Li G-Y

AU  - Gower AL

AU  - Destrade M

AU  - Yun S-H

ED  - 

DO  - DOI: 10.1038/s42005-022-01000-3

PB  - Springer Science and Business Media LLC

VL  - 5

IS  - 1

Y2  - 2024/12/22

ER  -