TY  - CONF

T1  - Chip cracks during assembly: Finding and eliminating the critical defect

JO  - 2011 IEEE 61st Electronic Components and Technology Conference (ECTC)

PY  - 2011/07/21

AU  - Sauter W

AU  - Kaldor S

AU  - Clark J

AU  - Laforte S

AU  - McCarthy C

AU  - Restaino D

AU  - Casey J

AU  - Questad D

ED  - 

DO  - DOI: 10.1109/ectc.2011.5898559

PB  - IEEE

SN  - 9781612844978

Y2  - 2024/12/22

ER  -