TY  - JOUR

T1  - Utilizing a low cost 3D packaging technology for consumer applications

JO  - IEEE T CONSUM ELECTR

PY  - 1995/11/01

AU  - Larcombe SP

AU  - Stern JM

AU  - Ivey PA

AU  - Seed L

ED  - 

VL  - 41

IS  - 4

SP  - 1095

EP  - 1102

Y2  - 2024/12/22

ER  -