TY  - CONF

T1  - Patterning copper using ink jet printing of Self Assembled Monolayers

JO  - 2007 9TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS 1 AND 2

PY  - 2007/01/01

AU  - Ebbens SJ

AU  - Hutt DA

AU  - Liu CQ

ED  - Vaidyanathan K

ED  - Tee TY

ED  - Lee TK

SP  - 114

EP  - 119

Y2  - 2024/12/22

ER  -