TY  - CONF

T1  - Thermal cycling reliability of polycrystalline diamond and aluminium nitride substrates

JO  - 2014 International Symposium on Power Electronics, Electrical Drives, Automation and Motion

PY  - 2014/01/01

AU  - Balakrishnan M

AU  - Sweet MR

AU  - Narayanan EMS

ED  - 

DO  - DOI: 10.1109/speedam.2014.6872061

PB  - IEEE

Y2  - 2024/10/23

ER  -